Title :
Design of a Standard Floating Point Chip
Author :
Troutman, W.W. ; Diodato, P.W. ; Goksel, A.K. ; Tsay, M.S. ; Krambeck, R.H.
Author_Institution :
AT&T Bell Laboratories, Murray Hill, New Jersey 07974
Keywords :
Chip scale packaging; Circuit topology; Fabrication; Integrated circuit interconnections; Iterative methods; Logic; Microprocessors; Timing; Trademarks; Very large scale integration;
Conference_Titel :
Solid-State Circuits Conference, 1985. ESSCIRC '85. 11th European
Conference_Location :
Toulouse, France
