DocumentCode :
51631
Title :
The Demonstration of Dislocation-Stress Memorization Technique Stressor on Si n-FinFETs
Author :
Liao, M.-H. ; Chen, P.-G.
Author_Institution :
Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Volume :
14
Issue :
4
fYear :
2015
fDate :
Jul-15
Firstpage :
657
Lastpage :
659
Abstract :
The dislocation stress memorization technique (D-SMT) stressor is demonstrated to boost the device performance on the Si three-dimensional (3-D) FinFET device. The larger channel stress and mobility enhancement ratio are observed in the narrower gate width device, due to the effect of triple crystal re-growth directions on the 3-D FinFET device. In this paper, ~33% mobility enhancement and ~23% Id,sat improvement on the Si FinFET device with W/L of 100/60 nm are achieved successfully with the implement of D-SMT stressor.
Keywords :
MOSFET; carrier mobility; dislocations; elemental semiconductors; silicon; Si; channel stress; dislocation-stress memorization technique stressor; gate width; mobility enhancement; three-dimensional n-FinFET; triple crystal regrowth directions; Crystals; FinFETs; Logic gates; Performance evaluation; Silicon; Stress; Three-dimensional displays; Dislocation-stress memorization technique (D-SMT); FinFET; Si; Stressor; dislocation-stress memorization technique (D-SMT); stressor;
fLanguage :
English
Journal_Title :
Nanotechnology, IEEE Transactions on
Publisher :
ieee
ISSN :
1536-125X
Type :
jour
DOI :
10.1109/TNANO.2015.2428698
Filename :
7100928
Link To Document :
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