DocumentCode
516539
Title
Sensor Design and Fabrication for Cointegration with Circuitry
Author
Baltes, Henry
Author_Institution
Physical Electronics Laboratory, ETH Zurich, CH-8093 Zurich, Switzerland
Volume
2
fYear
1991
fDate
11-13 Sept. 1991
Firstpage
23
Lastpage
28
Abstract
Sensor design and fabrication compatible with standard IC technologies has the advantages of on-chip signal conditioning circuitry and cost-effective batch fabrication. Thermomechanical microsensors realized by industrial CMOS or bipolar IC technology with IC-compatible postprocessing micromachining or deposition steps are presented. Examples include resistive and thermoelectric gas flow sensors, capacitive moisture sensors, and a thermally excited beam resonator.
Keywords
Bipolar integrated circuits; CMOS integrated circuits; CMOS technology; Capacitive sensors; Fabrication; Gas detectors; Microsensors; Signal design; Thermal sensors; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 1991. ESSCIRC '91. Proceedings - Seventeenth European
Conference_Location
Milan, Italy
Type
conf
Filename
5468328
Link To Document