Title :
Contactless Testing for Chip Verification
Author :
Wolfgang, E. ; Görlich, S. ; Kölzer, J.
Author_Institution :
Siemens AG, Corporate Research and Development, Otto-Hahn-Ring 6, D-8000 Munich 83, Germany
Abstract :
A brief description is given on the state of the art of three contactless testing techniques: Electron-beam testing, laser-beam testing and emission microscopy. First, reasons are given why contactless testing is still important for chip verification and failure analysis. Second, a scenario of contactless testing describes the influences of chip, package and CAD/CAT environment. Finally requirements for contactless testing as well as design for e-beam testability are discussed.
Keywords :
Boundary conditions; Circuit testing; Contacts; Design automation; Design engineering; Electron microscopy; Failure analysis; Integrated circuit testing; Logic testing; Organizing;
Conference_Titel :
Solid-State Circuits Conference, 1991. ESSCIRC '91. Proceedings - Seventeenth European
Conference_Location :
Milan, Italy
