DocumentCode :
516945
Title :
Tranisient Thermal Simulation and its Use in Power IC Design
Author :
Antognetti, P. ; Bisio, G.R. ; Curatelli, F. ; Palara, S.
Author_Institution :
University of Genova, Genova, Italy
fYear :
1979
fDate :
18-21 Sept. 1979
Firstpage :
67
Lastpage :
69
Keywords :
Boundary conditions; Computer interfaces; Fourier series; Integrated circuit modeling; Physics computing; Power dissipation; Power integrated circuits; Protection; Temperature; Thermal factors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Circuits Conference - ESSCIRC 79, Fifth European
Conference_Location :
Southampton, UK
Print_ISBN :
0-85296-208-8
Type :
conf
Filename :
5468959
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=516945
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