DocumentCode
5171
Title
Field Oxide n-channel MOS Dosimeters Fabricated in CMOS Processes
Author
Lipovetzky, J. ; Garcia-Inza, M.A. ; Carbonetto, S. ; Carra, M.J. ; Redin, E. ; Sambuco Salomone, L. ; Faigon, A.
Author_Institution
Device Phys.-Microelectron. Lab., Univ. de Buenos Aires, Buenos Aires, Argentina
Volume
60
Issue
6
fYear
2013
fDate
Dec. 2013
Firstpage
4683
Lastpage
4691
Abstract
This paper presents a new technique to build MOS dosimeters using unmodified standard CMOS processes. The devices are n-channel MOS transistors built with the regular Field Oxide as a thick radiation-sensitive gate. The devices were fabricated in two different commercial 0.6 μm CMOS processes, gate oxide thicknesses of ~600 nm and ~400 nm. Responsivities up to 4.4 mV/rad with positive bias, and 1.7 mV/rad with zero gate bias were obtained in the thicker oxides. The effect of charge trapped in the oxide and interface states on the shift in the threshold voltage are analyzed.
Keywords
MOSFET; dosimeters; semiconductor devices; charge trapped effect; commercial CMOS processes; fabricated devices; field oxide n-channel MOS dosimeters; gate oxide thicknesses; interface state; n-channel MOS transistors; positive bias; regular field oxide state; thick radiation-sensitive gate; threshold voltage shift; unmodified standard CMOS processes; zero gate bias; CMOS process; Charge carrier processes; Dosimetry; Electric fields; MOS devices; Radiation effects; Dosimeters; MOS devices; radiation effects; solid- state detectors;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2013.2287256
Filename
6678078
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