DocumentCode :
5171
Title :
Field Oxide n-channel MOS Dosimeters Fabricated in CMOS Processes
Author :
Lipovetzky, J. ; Garcia-Inza, M.A. ; Carbonetto, S. ; Carra, M.J. ; Redin, E. ; Sambuco Salomone, L. ; Faigon, A.
Author_Institution :
Device Phys.-Microelectron. Lab., Univ. de Buenos Aires, Buenos Aires, Argentina
Volume :
60
Issue :
6
fYear :
2013
fDate :
Dec. 2013
Firstpage :
4683
Lastpage :
4691
Abstract :
This paper presents a new technique to build MOS dosimeters using unmodified standard CMOS processes. The devices are n-channel MOS transistors built with the regular Field Oxide as a thick radiation-sensitive gate. The devices were fabricated in two different commercial 0.6 μm CMOS processes, gate oxide thicknesses of ~600 nm and ~400 nm. Responsivities up to 4.4 mV/rad with positive bias, and 1.7 mV/rad with zero gate bias were obtained in the thicker oxides. The effect of charge trapped in the oxide and interface states on the shift in the threshold voltage are analyzed.
Keywords :
MOSFET; dosimeters; semiconductor devices; charge trapped effect; commercial CMOS processes; fabricated devices; field oxide n-channel MOS dosimeters; gate oxide thicknesses; interface state; n-channel MOS transistors; positive bias; regular field oxide state; thick radiation-sensitive gate; threshold voltage shift; unmodified standard CMOS processes; zero gate bias; CMOS process; Charge carrier processes; Dosimetry; Electric fields; MOS devices; Radiation effects; Dosimeters; MOS devices; radiation effects; solid- state detectors;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2013.2287256
Filename :
6678078
Link To Document :
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