• DocumentCode
    517149
  • Title

    Readout Electronics For Wide Temperature Range With Integrated Surface Micromachined Capacitive Pressure Sensor

  • Author

    Schmidt, M. ; Spiegel, E. ; Dudaicevs, H. ; Manoli, Y. ; Mokwa, W.

  • Author_Institution
    Fraunhofer Institute for Microelectronics Circuits and Systems, Finkenstr. 61, 47057 Duisburg, Germany
  • fYear
    1995
  • fDate
    19-21 Sept. 1995
  • Firstpage
    230
  • Lastpage
    233
  • Abstract
    A monolithically integrated pressure sensor with on-chip readout electronics for a wide range of applications is presented. The circuit concept is optimized for a large temperature range (¿40...+125°C) and a minimum number of connections (three terminal device). The chip is fabricated in a 2 ¿m CMOS process with additional surface micromachining steps to implement the sensor. Using a pressure independent reference element the maximum overall temperature coefficient can be reduced to 500 ppm without any electronic compensation. The die size is 2.5 × 1.5 mm2.
  • Keywords
    Capacitive sensors; Circuits; Fabrication; Micromachining; Readout electronics; Sensor arrays; Sensor phenomena and characterization; Sensor systems; Temperature distribution; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 1995. ESSCIRC '95. Twenty-first European
  • Conference_Location
    Lille, France
  • Print_ISBN
    2-86332-180-3
  • Type

    conf

  • Filename
    5469282
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=517149