Title :
Readout Electronics For Wide Temperature Range With Integrated Surface Micromachined Capacitive Pressure Sensor
Author :
Schmidt, M. ; Spiegel, E. ; Dudaicevs, H. ; Manoli, Y. ; Mokwa, W.
Author_Institution :
Fraunhofer Institute for Microelectronics Circuits and Systems, Finkenstr. 61, 47057 Duisburg, Germany
Abstract :
A monolithically integrated pressure sensor with on-chip readout electronics for a wide range of applications is presented. The circuit concept is optimized for a large temperature range (¿40...+125°C) and a minimum number of connections (three terminal device). The chip is fabricated in a 2 ¿m CMOS process with additional surface micromachining steps to implement the sensor. Using a pressure independent reference element the maximum overall temperature coefficient can be reduced to 500 ppm without any electronic compensation. The die size is 2.5 à 1.5 mm2.
Keywords :
Capacitive sensors; Circuits; Fabrication; Micromachining; Readout electronics; Sensor arrays; Sensor phenomena and characterization; Sensor systems; Temperature distribution; Temperature sensors;
Conference_Titel :
Solid-State Circuits Conference, 1995. ESSCIRC '95. Twenty-first European
Conference_Location :
Lille, France
Print_ISBN :
2-86332-180-3