Title :
Computer Optimization in Biomechanics in Large Strain Level Compression Test
Author :
Li, Na ; Liu, JianXin
Author_Institution :
Sch. of Info-Phys. & Geomatics Eng., Central South Univ., Changsha, China
Abstract :
In the united states, traumatic brain injury (TBI) is the most common cause of death in vehicular crash. Biomechanical analysis of brain tissue is necessary because the experiment cost too much and the modeling achieved the mechanical simulation in vehicular crash. In order to obtain the mechanical properties of human brain tissue, in last 35 years, people did compression, shear, and oscillatory loading. The material modeling and the parameter reported vary from study to study. In this paper a method was utilizing to obtain uniform material properties by using Non-dominated Sorting Genetic Algorithm-II (NSGA-II). Ogden energy destiny function was utilized as the main constructive function in hyperelastic part, as the stress-strain curve vary with different strain rate, the G and beta present the relationship between stress and velocity in this material properties. Through Estes´s test, this optimization method obtain the mu is 882 Pa and alpha is 4.852, G is 29300 Pa.
Keywords :
biomechanics; brain; compressibility; elasticity; genetic algorithms; injuries; medical computing; physiological models; stress-strain relations; Estes´s test; NSGA-II; Ogden energy destiny function; biomechanics computer optimisation; brain tissue biomechanics; compression loading; hyperelasticity; large strain level compression test; nondominated sorting genetic algorithm-II; oscillatory loading; shear loading; stress-strain curve; traumatic brain injury; vehicular crash; Analytical models; Biomechanics; Brain injuries; Brain modeling; Capacitive sensors; Computational modeling; Costs; Material properties; Mechanical factors; Vehicle crash testing; Genetic Algorithm; compression test; constructive function; material properties;
Conference_Titel :
Communications and Mobile Computing (CMC), 2010 International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4244-6327-5
Electronic_ISBN :
978-1-4244-6328-2
DOI :
10.1109/CMC.2010.129