DocumentCode
517986
Title
Sensing field analysis of 3D direct capacitance imaging sensor
Author
Yan, Hua ; Ning, Xiukun ; Wang, Yifan ; Zhou, Yinggang
Author_Institution
Sch. of Inf. Sci. & Eng., Shenyang Univ. of Technol., Shenyang, China
Volume
1
fYear
2010
fDate
16-18 April 2010
Abstract
Classic electrical capacitance tomography (ECT) provides 2D images of a process cross section, and a “quasi” 3D image can be generated by stacking up the 2D images. But the 2D image obtained is a combined result of the medium in ECT sensor´s 3D sensing space, not of a slice of medium, which will reduce the degree of realism of the 3D image. 3D direct capacitance imaging acquires the 3D image directly from the measured capacitance data, transforms the inconveniences of the 3D sensing space into the benefit of 3D tomography. Analysis of the sensing fields of an ECT sensor should be carried out in the first design phase, so that the optimum result can be achieved. In this paper, the 3D sensitivity distribution of a 3D direct capacitance imaging sensor with 12-electrodes was studied by finite element method. The axial sensitivity distribution and the influence of the axial gap between measurement electrodes on the sensor´s sensitivities were focused on. Research shows that the change of axial gap between electrodes will result in non-notable difference in axial sensitivity distribution, while the position is radial (x- and y- axes) will result in notable difference in axial sensitivity distribution.
Keywords
capacitance measurement; capacitive sensors; finite element analysis; image sensors; tomography; 2D image; 3D direct capacitance imaging sensor; ECT sensor; axial sensitivity distribution; capacitance measurement; electrical capacitance tomography; finite element method; measurement electrode; quasi 3D image; sensing field analysis; Capacitance measurement; Capacitive sensors; Electrical capacitance tomography; Electrodes; Extraterrestrial measurements; Finite element methods; Image analysis; Image generation; Image sensors; Stacking; 3D direct imaging; ECT; finite element method; sensitivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Engineering and Technology (ICCET), 2010 2nd International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-6347-3
Type
conf
DOI
10.1109/ICCET.2010.5485369
Filename
5485369
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