Title :
Notice of Retraction
The reliability analysis of a micro-punching mold for IC packing bag
Author_Institution :
Dept. of Mech. & Comput.-Aided Eng., Nat. Formosa Univ., Huwei, Taiwan
Abstract :
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
This article is pointed to the reliability analysis of the micro-punching mold for plastic carrier tape. The parts´ dimensions of the punch were first determined by the specification of the plastic carrier tape. The parts would be manufactured and assembled, and the performance of the punch was tested subsequently. Through these inspections, all the dimension accuracy of the plastic carrier tape met the specification, and micro-punching mold´s reliability level confirms to design requirement.
Keywords :
integrated circuit packaging; integrated circuit reliability; moulding; plastic packaging; punching; IC packing bag; dimension accuracy; micropunching mold; plastic carrier tape; reliability analysis; Assembly; Density functional theory; Inspection; Manufacturing; Materials reliability; Plastics; Product design; Punching; Reliability engineering; Testing; IC packing bag; micro-punching mold; plastic carrier tape; reliability analysis;
Conference_Titel :
Computer Engineering and Technology (ICCET), 2010 2nd International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-6347-3
DOI :
10.1109/ICCET.2010.5485740
