Title :
Titanium alloy blade isothermal adjustment die design
Author :
Zhang, Hui ; Feng, Xiaoming ; Zhang Changming ; Guo, Congsheng
Author_Institution :
Sch. of Mater. Sci.&Eng., Shaanxi Univ. of Technol., Hanzhong, China
Abstract :
TC11 titanium alloy blade is one of aircraft engine important parts, its shape is complex and the quality requirement is high. The warps and the forgings may be discard due to the formed forging´s remaining stress and the temperature stress. But it is possible to use the isothermal adjustment process to reduce the warp distortion and make the blade shape to meet the qualified requirements. Three dimensional design software Pro/E was used to carry on the design in view of the uniform temperature adjustment mold, and which Pro/E software can mainly solve the mold cavity modeling problem. The three dimensional surface modeling of blade is carried out and the heating and cooling devices for the isothermal sizing die are designed simultaneously. Its design flow is: creating the three dimensional entity of the blade, adding margin to the blade, using entity to set up the mold cavity, adding the mold structural elements, and designing heating and cooling system.
Keywords :
CAD; aerospace engines; blades; dies (machine tools); forging; production engineering computing; quality control; sizing (materials processing); thermal stresses; titanium alloys; TC11 titanium alloy blade; TiJkJk; aircraft engine parts; cooling devices; forging; heating devices; isothermal adjustment process; isothermal adjustment sizing die design; isothermal sizing die; mold cavity modeling problem; quality requirement; temperature adjustment mold; temperature stress; three dimensional surface modeling; three-dimensional design software Pro/E; warp distortion reduction; Aircraft propulsion; Blades; Cooling; Heating; Isothermal processes; Shape memory alloys; Software design; Stress; Temperature; Titanium alloys; Blade Shape; Heats Up and the Cooling System; Isothermal Sizing Die; TC11 Titanium Alloy Blade;
Conference_Titel :
Computer Engineering and Technology (ICCET), 2010 2nd International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-6347-3
DOI :
10.1109/ICCET.2010.5485848