Title :
Notice of Retraction
Load frequency effect on gigacycle fatigue properties of superalloy inconel 718
Author :
Zheng Duan ; Huiji Shi ; Xianfeng Ma
Author_Institution :
AML, Tsinghua Univ., Beijing, China
Abstract :
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
Fatigue behaviors of the superalloy inconel 718 under gigacycle regime with load frequencies of 52.5 Hz and 20 kHz were investigated in this paper. The results indicated that there are gigacycle fatigue failure behaviors for this material. On the one hand, some specimens were submitted to conventional rotating bending experiments with a frequency of 52.5 Hz. On the other hand some were submitted to 20 kHz ultrasonic loading experiments. Apparently, different S-N curves could be observed for both experiments. The fracture photographs through SEM were compared and the effects of the frequency on the fracture mechanism were analyzed.
Keywords :
bending; chromium alloys; dislocations; failure (mechanical); fatigue; fracture mechanics; iron alloys; nickel alloys; scanning electron microscopy; superalloys; ultrasonic materials testing; CrNiFe; S-N curves; SEM; conventional rotating bending experiments; fracture mechanism; fracture photographs; frequency 20 kHz; frequency 52.5 Hz; gigacycle fatigue failure behaviors; gigacycle regime; load frequency effect; superalloy inconel 718; ultrasonic loading experiments; Aerospace materials; Chemicals; Composite materials; Cooling; Crystalline materials; Fatigue; Frequency; Mechanical factors; Temperature control; Temperature sensors; dislocation; frequency effects; gigacycle fatigue;
Conference_Titel :
Computer Engineering and Technology (ICCET), 2010 2nd International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-6347-3
DOI :
10.1109/ICCET.2010.5485913
