• DocumentCode
    518315
  • Title

    Notice of Retraction
    Molecular dynamics study of silicate glass under shock

  • Author

    Luming Shen

  • Author_Institution
    Sch. of Civil Eng., Univ. of Sydney, Sydney, NSW, Australia
  • Volume
    5
  • fYear
    2010
  • fDate
    16-18 April 2010
  • Abstract
    Notice of Retraction

    After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

    We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

    The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

    Molecular dynamics (MD) simulations are conducted to study the dynamic responses of silicate glass shocked at velocities from 1 to 19 km/s. The simulated pressure and density of the glass under shock increase as the cooling rate increases, although the effect of the cooling rate on the shock wave velocity is limited. It appears the simulation results match well with the experimental and EOS analysis data for the glass shocked under particle velocity below 10 km/s. However, the simulations under-estimate the density of the glass sample shocked at particle velocities between 12 km/s and 19 km/s.
  • Keywords
    density; glass; high-pressure effects; high-temperature effects; molecular dynamics method; shock wave effects; EOS analysis data; SiO2; cooling rate effect; dynamic responses; glass density; molecular dynamics simulations; particle velocity; shock wave velocity; shocked silicate glass; simulated pressure; simulation results; velocity 1 km/s to 19 km/s; Cooling; Earth; Electric shock; Glass; Optical materials; Plasma temperature; Shock waves; Silicon compounds; Testing; Ultraviolet sources; high pressure; high temperature; molecular dynamics; shock; silicate glassc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Engineering and Technology (ICCET), 2010 2nd International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-6347-3
  • Type

    conf

  • DOI
    10.1109/ICCET.2010.5486016
  • Filename
    5486016