Title :
Notice of Retraction
Effect of temperature increasing on nanofluid structure
Author :
Hosseini, S.Sh. ; Adam, N.M. ; Azmi, Z. ; Abolfazl Ahmadi, A.A.
Abstract :
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
Nanofluids which are known as new generation of thermal fluids have particular features which were affected on their behavior. One of these features is response of nanofluids to temperature changes. Ultrasonic mixer is used to prepare the nanofluid. Ultrasonic mixer sends out waves and the wave itself makes the heat. Numbers of encounters between nanoparticles also are increased by increasing the temperature. These collapses may lead to agglomeration or recrystallization of nanoparticles. In this work, the attempted made to study structural changes of nanofluid as increasing the temperature which is very important for engineering designs. Obtained results for nanofluids were illustrated that the temperature in nanofluid was increased in lower ranges than pure water. Water-copper oxide and also water-alumina nanofluids were used.
Keywords :
alumina; copper compounds; fluids; mixtures; nanofabrication; nanoparticles; recrystallisation; water; H2O-Al2O3; H2O-CuO; agglomeration; nanofluid structure; nanoparticles; recrystallization; temperature effect; thermal fluids; ultrasonic mixer; water-alumina nanofluids; water-copper oxide; Copper; Impurities; Mechanical engineering; Nanoparticles; Nanostructures; Power engineering and energy; Renewable energy resources; Temperature sensors; Testing; Thermal conductivity; Nanofluids; Ultrasonic prop;
Conference_Titel :
Computer Engineering and Technology (ICCET), 2010 2nd International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-6347-3
DOI :
10.1109/ICCET.2010.5486178