Notice of RetractionInfluence of wafer fabrication technology on wire bond process

Notice of Retraction

After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

Wire bond process is the main area bringing the package into functionality as it plays the main role into connecting between chip and lead frame. Therefore, the main concern in this process is the bond ability and reliability of the process. This paper will mainly discuss on the remaining challenges of wafer fabrication technology towards wire bond process. Therefore, a few investigations had been carried out to study the defect such as obvious separation gaps detected after cross section at the initial state of wire bond process. The critical point here is to identify issue arising from wire bond process or other influences. Hence, an experiment had been carried out to evaluate on wire bond process and the as received bond pad are discussed in details. The outputs of the results mainly impacted by the contaminated bond pad which comes from front of line process.