Title :
Value added Packaging Of Microsystems
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration (FhG-IZM), Berlin, Germany
Abstract :
Packaging of Microsystems is one of the key technologies for success or failure of a product in the market. Performance aspects, reliability performance, cost and fabrication volume capability are among the factors governed by packaging - if not properly met, even a well designed component will not meet the market requirements. This paper targets to provide an overview on viable technologies for packaging specifically towards the suitability for micro-systems with multiple individual components which need to operate seamlessly.
Keywords :
cost accounting; electronics packaging; micromechanical devices; reliability; cost; fabrication volume capability; microsystems; reliability; value added packaging; Bonding; Cost function; Fabrication; Intelligent sensors; Mechanical sensors; Moore´s Law; Packaging; Product design; TV; Wire;
Conference_Titel :
Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
Conference_Location :
Seville
Print_ISBN :
978-1-4244-6636-8
Electronic_ISBN :
978-2-35500-011-9
