Leak detection methods for glass capped and polymer sealed MEMS packages

Author

Millar, Suzanne ; Desmulliez, Marc P Y ; McCracken, Stewart

Author_Institution

Microsyst. Eng. Centre (MISEC), Heriot-Watt Univ., Edinburgh, UK

fYear

2010

fDate

5-7 May 2010

Firstpage

10

Lastpage

15

Abstract

This paper presents the limitations of the helium leak test when applied to typical MEMS packages. Hermeticity testing using FTIR and Raman spectroscopy are investigated with a view to overcoming the limitations of the helium leak test method. Hermeticity testing using FTIR is successful demonstrated for low cavity volume MEMS and glass packaged devices. Raman spectroscopy also improves on these limitations and can be considered to determine leak rates caused by outgassing or permeation through package materials.

Keywords

Raman spectroscopy; electronics packaging; micromechanical devices; FTIR; Raman spectroscopy; glass capped MEMS packages; glass packaged devices; helium leak test method; hermeticity testing; leak detection methods; leak rates; outgassing; permeation; polymer sealed MEMS packages; Detectors; Glass; Helium; Leak detection; Micromechanical devices; Polymers; Seals; Semiconductor device packaging; Spectroscopy; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on

Conference_Location

Seville

Print_ISBN

978-1-4244-6636-8

Electronic_ISBN

978-2-35500-011-9

Type

conf

Filename

5486472