DocumentCode :
518548
Title :
Leak detection methods for glass capped and polymer sealed MEMS packages
Author :
Millar, Suzanne ; Desmulliez, Marc P Y ; McCracken, Stewart
Author_Institution :
Microsyst. Eng. Centre (MISEC), Heriot-Watt Univ., Edinburgh, UK
fYear :
2010
fDate :
5-7 May 2010
Firstpage :
10
Lastpage :
15
Abstract :
This paper presents the limitations of the helium leak test when applied to typical MEMS packages. Hermeticity testing using FTIR and Raman spectroscopy are investigated with a view to overcoming the limitations of the helium leak test method. Hermeticity testing using FTIR is successful demonstrated for low cavity volume MEMS and glass packaged devices. Raman spectroscopy also improves on these limitations and can be considered to determine leak rates caused by outgassing or permeation through package materials.
Keywords :
Raman spectroscopy; electronics packaging; micromechanical devices; FTIR; Raman spectroscopy; glass capped MEMS packages; glass packaged devices; helium leak test method; hermeticity testing; leak detection methods; leak rates; outgassing; permeation; polymer sealed MEMS packages; Detectors; Glass; Helium; Leak detection; Micromechanical devices; Polymers; Seals; Semiconductor device packaging; Spectroscopy; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
Conference_Location :
Seville
Print_ISBN :
978-1-4244-6636-8
Electronic_ISBN :
978-2-35500-011-9
Type :
conf
Filename :
5486472
Link To Document :
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