DocumentCode :
518553
Title :
Modeling and finite element analysis of mechanical behavior of flexible MEMS components
Author :
Pustan, Marius ; Paquay, Stéphane ; Rochus, Véronique ; Golinval, Jean-Claude
Author_Institution :
LTAS-Liege, Univ. of Liege, Liege, Belgium
fYear :
2010
fDate :
5-7 May 2010
Firstpage :
171
Lastpage :
176
Abstract :
This paper describes the studies of the mechanical characteristics of flexible MEMS components including theoretical approach, finite element analysis and experimental investigations. Modeling and finite element analyses together with theoretical and experimental investigations are performed to estimate the mechanical behaviour of MEMS components as microcantilevers, microbridges and micromembranes. The finite element analysis of microcomponents deflections under different loading and the stress distribution in beams is determined and compared with the experimental measurements performed using atomic force microscope. The modeling of a micromembrane supported by four hinges that enable out-of-plane and in-plane motions is presented. Finite element analysis and experimental investigations are performed to estimate the deflection of the mobile plate of the micromembrane under an applied force and to visualize the distribution of the stress in hinges. In additional, this paper provides analytical relations for stiffness and stresses of the investigated flexible MEMS components.
Keywords :
atomic force microscopy; elasticity; finite element analysis; micromechanical devices; atomic force microscope; finite element analysis; flexible MEMS components; hinge; mechanical characteristics; micromembrane; mobile plate deflection; stiffness; stress distribution; Atomic beams; Atomic force microscopy; Atomic measurements; Fasteners; Finite element methods; Force measurement; Micromechanical devices; Performance analysis; Performance evaluation; Stress measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
Conference_Location :
Seville
Print_ISBN :
978-1-4244-6636-8
Electronic_ISBN :
978-2-35500-011-9
Type :
conf
Filename :
5486477
Link To Document :
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