DocumentCode
51856
Title
Electrothermal Effects on Performance of GaAs HBT Power Amplifier During Power Versus Time (PVT) Variation at GSM/DCS Bands
Author
Liang Lin ; Liang Zhou ; Rui Wang ; Lei Tong ; Wen-Yan Yin
Author_Institution
Key Lab. of Minist. of Educ. for the Design & EMC of High-Speed Electron. Syst., Shanghai Jiao Tong Univ., Shanghai, China
Volume
63
Issue
6
fYear
2015
fDate
Jun-15
Firstpage
1951
Lastpage
1963
Abstract
Power versus time (PVT) variation is one of the most important features for describing electrothermal performance of RF power amplifiers (PAs) for global system for mobile communication/digital cellular system bands. The PA sometimes produces high power at the first time slot and low power at the second time slot, which results in similar temperature variation caused by its self-heating effect. Therefore, both theoretical and experimental investigations are carried out for capturing electrothermal effects on the performance of GaAs-based heterojunction bipolar transistor (HBT) PAs. The temperature distribution over the PA die is obtained using our in-house developed finite-element method algorithm and a thermal infrared scanner, respectively. In particular, the PVT variation of the PA for a two time slot, as well as a four time slot (i.e., 75% of its operation time is in the “power on” state) case is studied in detail. Furthermore, an improved design for the GaAs HBT PA chip is performed, fabricated, and tested with its PVT variation suppressed effectively. This study should be very useful for the development of PAs for many wireless communications.
Keywords
III-V semiconductors; finite element analysis; gallium arsenide; heterojunction bipolar transistors; radiofrequency power amplifiers; temperature distribution; GSM-DCS band; GaAs; HBT power amplifier; PA; PVT variation; RF power amplifier; electrothermal performance; finite-element method algorithm; global system for mobile communication-digital cellular system band; heterojunction bipolar transistor; power versus time variation; self-heating effect; temperature distribution; thermal infrared scanner; wireless communication; CMOS integrated circuits; GSM; Gallium arsenide; Heterojunction bipolar transistors; Power generation; Radio frequency; Voltage control; Electrothermal effect; GaAs heterojunction bipolar transistor (HBT); Gaussian minimum shift keying (GMSK); finite-element method (FEN); global system for mobile communication (GSM)/digital cellular system (DCS); power amplifier (PA); power versus time (PVT);
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2015.2424695
Filename
7100956
Link To Document