• DocumentCode
    518562
  • Title

    An approach for systematic behavioral modeling of micro systems

  • Author

    Schneider, Peter ; Reitz, Sven ; Elst, Günter ; Wilde, Andreas

  • Author_Institution
    Design Autom. Div., Fraunhofer Inst. for Integrated Circuits, Dresden, Germany
  • fYear
    2010
  • fDate
    5-7 May 2010
  • Firstpage
    85
  • Lastpage
    90
  • Abstract
    In the design process of micro systems their heterogeneity is one major issue. This heterogeneity is caused by a close coupling of different physical effects as well as a strong influence of manufacturing technologies and operation conditions on the system behavior. System level simulation of micro systems features outstanding potentials for a comprehensive design support covering the whole range from specification phase to implementation. The basic prerequisite to take advantage of these potentials is the availability of models for all important components. However, currently there is a lack of methodological approaches for the systematic formulation of behavioral models. Therefore, a methodological modeling approach is proposed which aims at a systematic formulation of behavioral models for multi physics systems. It covers analysis and partitioning of the micro system, the description of physical effects, the mapping to a unified mathematical representation by equations, as well as approaches for model abstraction. The successful application of this modeling methodology will be described using some examples from industrial design tasks.
  • Keywords
    Monte Carlo methods; micromechanical devices; MEMS; Monte Carlo analysis; manufacturing technology; methodological modeling approach; microsystem design process; multiphysics systems; physical effect coupling; system level simulation; systematic behavioral modeling; Connectors; Coupling circuits; Design automation; Integrated circuit modeling; Integrated circuit technology; Manufacturing; Mathematical model; Physics; Power system modeling; Process design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
  • Conference_Location
    Seville
  • Print_ISBN
    978-1-4244-6636-8
  • Electronic_ISBN
    978-2-35500-011-9
  • Type

    conf

  • Filename
    5486490