Title :
Large area micro roller embossing using low cost flexible mould fabricated from polymer-metal film
Author :
Shan, Xuechuan ; Soh, Y.C. ; Jin, L. ; Lu, C.W.
Author_Institution :
Singapore Inst. of Manuf. Technol. (SIMTech), Singapore, Singapore
Abstract :
A method to fabricate a low cost, large area and flexible mould and its applications in large area roller embossing are presented in this paper. A liquid crystal polymer (LCP) film, which had a glass transition temperature as high as 280°C and was clad with a copper foil on each side, was used as a starting material for mould fabrication. The LCP film and the copper foil were 50 μm and 36 μm thick, respectively. The copper foil was patterned via photolithography and copper etching process. A large polymer-metal hybrid flexible mould of 200 × 200 mm2 (effective pattern area: 150 × 150 mm2) was fabricated. The fabricated mould has a minimum feature size of 25 μm, and has been used to demonstrate large area micro roller embossing as well as ultraviolet casting. Microfluidic devices were embossed on polymeric as well as ceramic green substrates.
Keywords :
embossing; liquid crystal polymers; microfluidics; polymer films; LCP film; ceramic green substrates; copper etching process; large area micro roller embossing; large area roller embossing; large polymer-metal hybrid flexible mould; liquid crystal polymer film; low cost flexible mould; microfluidic devices; mould fabrication; photolithography; polymer-metal film; polymeric substrates; size 25 mum; size 36 mum; size 50 mum; temperature 280 C; ultraviolet casting; Copper; Costs; Crystalline materials; Embossing; Fabrication; Glass; Liquid crystal polymers; Lithography; Polymer films; Temperature;
Conference_Titel :
Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
Conference_Location :
Seville
Print_ISBN :
978-1-4244-6636-8
Electronic_ISBN :
978-2-35500-011-9