Title :
Active Carbon-ceramic Sphere as Support of Ruthenium Catalysts: Characterization and Catalytic Wet Air Oxidation (CWAO) of Resin Effluent
Author :
Liu, WeiMin ; Hu, YiQiang ; Tu, ShanTung
Author_Institution :
Key Lab. of Pressure Syst. & Safety, Univ. of Sci. & Technol., Shanghai, China
Abstract :
Active carbon-ceramic sphere as support of ruthenium catalysts were evaluated through the catalytic wet air oxidation (CWAO) of resin effluent in a packed-bed reactor. Active carbon-ceramic sphere and ruthenium catalysts were characterized by N2 adsorption, CO chemisorption and SEM measurements. BET surface area and total pore volume of active carbon(AC) in active carbon-ceramic sphere increase with increasing KOH-to-Carbon ratio, AC in the sample KC-120 possesses values as high as 1100 m2 g-1 and 0.69 cm3 g-1(carbon percentage: 4.73 wt. %), especially. Active carbon-ceramic sphere supported ruthenium catalysts were prepared using the RuCl3 solution impregnation onto KC-120, the ruthenium loading was fixed at 1-5 wt. % of AC in the support. As optimum catalyst, the 3 wt. % Ru/KC-120 catalyst displays the higher stability in the CWAO of resin effluent during 30 days. Chemical oxygen demand (COD) and phenol removal were about 92% and 96% at the reaction temperature of 200°C, oxygen pressure of 1.5 MPa, the water flow rate of 0.75 L h-1 and the oxygen flow rate of 13.5 L h-1.
Keywords :
activated carbon; catalysts; chemical reactors; chemisorption; ruthenium; scanning electron microscopy; wastewater treatment; BET surface; SEM; active carbon-ceramic sphere; catalytic wet air oxidation; chemical oxygen demand; chemisorption; packed-bed reactor; phenol removal; phenol wastewater; pressure 1.5 MPa; reaction temperature; resin effluent; ruthenium catalysts; temperature 200 C; time 30 day; Ceramics; Effluents; Inductors; Organic compounds; Organic materials; Oxidation; Resins; Stability; Temperature; Wastewater; CWAO; Ru; active carbon-ceramic sphere; resin effluent;
Conference_Titel :
Challenges in Environmental Science and Computer Engineering (CESCE), 2010 International Conference on
Conference_Location :
Wuhan
Print_ISBN :
978-0-7695-3972-0
Electronic_ISBN :
978-1-4244-5924-7
DOI :
10.1109/CESCE.2010.73