Title :
A W-band active frequency-multiplier-by-six in waveguide package
Author :
Kallfass, I. ; Tessmann, A. ; Massler, H. ; Kuri, M. ; Riessle, M. ; Zink, M. ; Leuther, A.
Author_Institution :
Fraunhofer Inst. for Appl. Solid-State Phys. (IAF), Freiburg, Germany
Abstract :
We demonstrate a broadband active frequency-multiplier-by-six for the W-band (75-110 GHz), mounted in a waveguide package. The frequency-multiplying function is performed in a single MMIC using a cascade of balanced tripler and doubler stages. The MMIC, realized in metamorphic HEMT technology, is mounted by wire bonding and high performance waveguide-to-microstrip transitions into a split-block waveguide module containing an integrated voltage supply board. The module achieves an output power of 2.5 dBm, with an associated conversion gain of 0.5 dB, and a 3-dB output bandwidth of 21.5%, corresponding to a frequency range from 83 to 103 GHz. Unwanted harmonics in the output spectrum are suppressed by more than 18 dB. The application of the employed packaging technique to frequencies up to 325 GHz is discussed.
Keywords :
MMIC; electronics packaging; frequency multipliers; high electron mobility transistors; lead bonding; MMIC; W-band active frequency-multiplier-by-six; broadband active frequency-multiplier-by-six; frequency-multiplying function; high performance waveguide-to-microstrip transition; integrated voltage supply board; metamorphic HEMT technology; split-block waveguide module; waveguide package; wire bonding; Bonding; Frequency; Gain; MMICs; Packaging; Power generation; Voltage; Waveguide transitions; Wire; mHEMTs; MMICs; W-band; mHEMT; millimeter-wave FET integrated circuits; millimeter-wave frequency multiplier;
Conference_Titel :
Microwave Conference, 2010 German
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-4933-0
Electronic_ISBN :
978-3-9812668-1-8