DocumentCode :
521746
Title :
Subpixel In-Plane Displacement Measurement Using Digital Image Correlation and Artificial Neural Networks
Author :
Liu, Xiaoyong ; Tan, Qingchang
Author_Institution :
Inst. of Mech. Sci. & Eng., Jilin Univ., Changchun, China
fYear :
2010
fDate :
19-21 June 2010
Firstpage :
1
Lastpage :
4
Abstract :
Development in digital image correlation have made it a widely and effective tool for full-field displacement and displacement gradients measurement in solid and fluid mechanics. The main method to improve accuracy is to use the subpixel registration algorithm in digital image correlation. This paper presents an in-plane subpixel displacement detection method based on Fourier Transformation and ANN. Correlation coefficients of subimages in undeformed and deformed images of specimen surface have a peak, the position of which represent the integer pixel displacement. Subpixel displacement is obtained in this paper by training ANN to estimate. Results from computer-simulated images indicate techniques can obtain similar accuracies compared with other subpixel algorithms, but the ANN approach has the advantage that it can complete very fast subpixel displacement analysis without knowledge of the analytical form of local correlation coefficient.
Keywords :
Fourier transforms; artificial intelligence; correlation methods; displacement measurement; image registration; neural nets; ANN; Fourier transformation; artificial neural networks; digital image correlation coefficient; fluid mechanics; full-field displacement gradient measurement; image deformation; integer pixel displacement; solid mechanics; subpixel in-plane displacement measurement; subpixel registration algorithm; Algorithm design and analysis; Artificial neural networks; Digital images; Displacement measurement; Fourier transforms; Image analysis; Interpolation; Nonlinear equations; Strain measurement; Surface fitting;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photonics and Optoelectronic (SOPO), 2010 Symposium on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-4963-7
Electronic_ISBN :
978-1-4244-4964-4
Type :
conf
DOI :
10.1109/SOPO.2010.5504483
Filename :
5504483
Link To Document :
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