• DocumentCode
    52212
  • Title

    Meeting the Challenge of Multiple Threshold Voltages in Highly Scaled Undoped FinFETs

  • Author

    Muralidhar, R. ; Jin Cai ; Frank, David J. ; Oldiges, P. ; Lu, Dan ; Lauer, I.

  • Author_Institution
    Thomas J. Watson Res. Center, IBM, Yorktown Heights, NY, USA
  • Volume
    60
  • Issue
    3
  • fYear
    2013
  • fDate
    Mar-13
  • Firstpage
    1276
  • Lastpage
    1278
  • Abstract
    Undoped FinFETs are of significant technological interest as they mitigate variation from random discrete dopant effects and provide for density and voltage scaling. A key requirement for undoped FinFETs for VLSI system application is the ability to obtain multiple threshold voltages on chip. This brief discusses options to obtain one logic and one SRAM threshold for both NFETs and PFETs in highly scaled undoped fins and shows that achieving such dual thresholds is challenging and requires new solutions such as more than two metal-gate work functions, dual fin thicknesses, or dual channel materials.
  • Keywords
    MOSFET; SRAM chips; VLSI; integrated logic circuits; NFET; PFET; SRAM threshold; VLSI system application; density scaling; dual channel material; dual fin thicknesses; highly scaled undoped FinFET; logic threshold; metal-gate work function; multiple threshold voltages; random discrete dopant effects; voltage scaling; Doping; Electrostatics; FinFETs; Logic gates; Random access memory; Silicon germanium; FinFETs; TCAD; multiple device thresholds; short-channel control;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2241767
  • Filename
    6459575