DocumentCode
52212
Title
Meeting the Challenge of Multiple Threshold Voltages in Highly Scaled Undoped FinFETs
Author
Muralidhar, R. ; Jin Cai ; Frank, David J. ; Oldiges, P. ; Lu, Dan ; Lauer, I.
Author_Institution
Thomas J. Watson Res. Center, IBM, Yorktown Heights, NY, USA
Volume
60
Issue
3
fYear
2013
fDate
Mar-13
Firstpage
1276
Lastpage
1278
Abstract
Undoped FinFETs are of significant technological interest as they mitigate variation from random discrete dopant effects and provide for density and voltage scaling. A key requirement for undoped FinFETs for VLSI system application is the ability to obtain multiple threshold voltages on chip. This brief discusses options to obtain one logic and one SRAM threshold for both NFETs and PFETs in highly scaled undoped fins and shows that achieving such dual thresholds is challenging and requires new solutions such as more than two metal-gate work functions, dual fin thicknesses, or dual channel materials.
Keywords
MOSFET; SRAM chips; VLSI; integrated logic circuits; NFET; PFET; SRAM threshold; VLSI system application; density scaling; dual channel material; dual fin thicknesses; highly scaled undoped FinFET; logic threshold; metal-gate work function; multiple threshold voltages; random discrete dopant effects; voltage scaling; Doping; Electrostatics; FinFETs; Logic gates; Random access memory; Silicon germanium; FinFETs; TCAD; multiple device thresholds; short-channel control;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2241767
Filename
6459575
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