Title :
RLC interconnect modeling using delay algebraic equations
Author :
Roy, Sourajeet ; Dounavis, Anestis
Abstract :
This paper presents a model for fast transient analysis for single line resistance-inductance-capacitance (RLC) on-chip interconnects. The proposed algorithm, based on a modified Lie formula, is used to convert the solution of the transmission line network into delay algebraic equations, which can be solved in a closed form manner. The proposed algorithm is not limited to fixed number of coupled RLC lines or to specific topologies and can be used to model both identical and non-identical multi-conductor lines and loads.
Keywords :
Lie algebras; RLC circuits; integrated circuit interconnections; integrated circuit modelling; transient analysis; Lie formula; RLC interconnect modeling; RLC on-chip interconnects; coupled RLC lines; delay algebraic equation; multiconductor lines; multiconductor loads; single line resistance-inductance-capacitance; transient analysis; transmission line network; Decision support systems; Delay; Equations; Virtual reality;
Conference_Titel :
Circuits and Systems Workshop,(DCAS), 2009 IEEE Dallas
Conference_Location :
Richardson, TX
Print_ISBN :
978-1-4244-5483-9
Electronic_ISBN :
978-1-4244-5484-6
DOI :
10.1109/DCAS.2009.5505769
