Title :
Kinematics analysis of bridge-type micro-displacement mechanism based on flexure hinge
Author :
Ye Guo ; Li Wei ; Wang Yu-qiao ; Yang Xue-feng ; Yu Ling
Author_Institution :
Coll. of Mech. & Electr. Eng., China Univ. of Min. & Technol., Xuzhou, China
Abstract :
Bridge-type micro-displacement mechanism based on flexible hinge is a classical displacement magnifying mechanism. A flexible branched chain model was established to analyze the characteristics of the mechanism according to its symmetrical structure, thus the formulas for calculating output displacement and displacement amplification ratio of the displacement amplification mechanism were derived. Finite element simulation was carried on by software ANSYS11.0, and then compared with the theoretical model. Finally, an experiment sample piece was designed and processed to verify the theoretical model. The results showed that: the displacement amplification ratio of the bridge-type micro-displacement mechanism will increase first and then decrease, while the distance of the flexible hinges ly increase, and when the influence angle of amplification ratio α = 0.688°, the displacement amplification ratio get its maximum; Bridge-type micro-displacement mechanism can realize a displacement amplification ratio of more than 40 times, but the error will be amplified at the same time, so the amplification ratio of the bridge-type amplification mechanism should not be too large.
Keywords :
fasteners; finite element analysis; kinematics; micropositioning; ANSYS11.0 software; amplification ratio; branched chain model; bridge type microdisplacement mechanism; displacement amplification mechanism; displacement magnifying mechanism; flexure hinge; kinematics analysis; Automation; Educational institutions; Educational programs; Electrical engineering; Fasteners; Finite element methods; Kinematics; Mathematical model; Piezoelectric actuators; Process design; bridge-type micro-displacement mechanism; displacement amplification ratio; finite element simulation; flexure hinge;
Conference_Titel :
Information and Automation (ICIA), 2010 IEEE International Conference on
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-5701-4
DOI :
10.1109/ICINFA.2010.5512338