• DocumentCode
    523042
  • Title

    Evaluating design tradeoffs in on-chip power management for CMPs

  • Author

    Sharkey, J. ; Buyuktosunoglu, Alper ; Bose, Pradip

  • Author_Institution
    IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    2007
  • fDate
    27-29 Aug. 2007
  • Firstpage
    44
  • Lastpage
    49
  • Abstract
    In light of the recent shift towards multi-core processor designs, dynamic power-management techniques that were designed for single-core microprocessors must be augmented with larger chip-level control. In this paper, we explore the design-tradeoffs associated with CMP power management solutions in a full-system simulation environment. We show that global power management solutions outperform solutions that locally manage power per-core. We then show that global power management is most effective at finer granularities that allow it to adapt to changing workload behavior and thus conclude that on-chip hardware solutions for CMP power management are an important consideration for future CMP microprocessors.
  • Keywords
    microprocessor chips; chip multiprocessor; chip-level control; design tradeoff evaluation; global power management; multicore processor designs; on-chip power management; single-core microprocessors; workload behavior; Dynamic voltage scaling; Energy consumption; Energy management; Environmental management; Hardware; Microprocessors; Multicore processing; Power system management; Power system modeling; Process design; chip multi-processor; dynamic voltage scaling; fetch throttling; power-aware;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics and Design (ISLPED), 2007 ACM/IEEE International Symposium on
  • Conference_Location
    Portland, OR
  • Electronic_ISBN
    978-1-59593-709-4
  • Type

    conf

  • DOI
    10.1145/1283780.1283791
  • Filename
    5514267