DocumentCode
523042
Title
Evaluating design tradeoffs in on-chip power management for CMPs
Author
Sharkey, J. ; Buyuktosunoglu, Alper ; Bose, Pradip
Author_Institution
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2007
fDate
27-29 Aug. 2007
Firstpage
44
Lastpage
49
Abstract
In light of the recent shift towards multi-core processor designs, dynamic power-management techniques that were designed for single-core microprocessors must be augmented with larger chip-level control. In this paper, we explore the design-tradeoffs associated with CMP power management solutions in a full-system simulation environment. We show that global power management solutions outperform solutions that locally manage power per-core. We then show that global power management is most effective at finer granularities that allow it to adapt to changing workload behavior and thus conclude that on-chip hardware solutions for CMP power management are an important consideration for future CMP microprocessors.
Keywords
microprocessor chips; chip multiprocessor; chip-level control; design tradeoff evaluation; global power management; multicore processor designs; on-chip power management; single-core microprocessors; workload behavior; Dynamic voltage scaling; Energy consumption; Energy management; Environmental management; Hardware; Microprocessors; Multicore processing; Power system management; Power system modeling; Process design; chip multi-processor; dynamic voltage scaling; fetch throttling; power-aware;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Power Electronics and Design (ISLPED), 2007 ACM/IEEE International Symposium on
Conference_Location
Portland, OR
Electronic_ISBN
978-1-59593-709-4
Type
conf
DOI
10.1145/1283780.1283791
Filename
5514267
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