DocumentCode :
524106
Title :
Power delivery for high performance microprocessors
Author :
Balasubramanian, S.
Author_Institution :
Intel Corp., Bangalore, India
fYear :
2008
fDate :
11-13 Aug. 2008
Firstpage :
239
Lastpage :
240
Abstract :
Summary form only given. Robust power delivery is considered one the prime challenges in chip design today. As the frequency and complexity of microprocessors increase, the static and dynamic components of power supply noise increase. However, keeping with Moore´s law, the voltage supply to semiconductor chips have been scaling down, thereby reducing margins. There are other challenges including efficiency and power dissipation of the power delivery sub system itself. This presentation will try to discuss these challenges and the solutions employed by the industry to over come of these. The talk will conclude with some discussion on future technologies to improve the overall efficiency of power delivery.
Keywords :
integrated circuit design; logic design; microprocessor chips; Moore law; chip design; dynamic component; high performance microprocessor; power delivery; power dissipation; power supply noise; semiconductor chip; static component; voltage supply; Chip scale packaging; Dynamic voltage scaling; Frequency; Microprocessors; Moore´s Law; Noise robustness; Power dissipation; Power supplies; Power system dynamics; Semiconductor device noise; microprocessors; motherboard; power delivery; regulator; supply noise; vrm;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Low Power Electronics and Design (ISLPED), 2008 ACM/IEEE International Symposium on
Conference_Location :
Bangalore
Print_ISBN :
978-1-4244-8634-2
Electronic_ISBN :
978-1-60558-109-5
Type :
conf
DOI :
10.1145/1393921.1393985
Filename :
5529047
Link To Document :
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