• DocumentCode
    524252
  • Title

    Temperature-aware energy minimization technique through dynamic voltage frequency scaling for embedded systems

  • Author

    Shu, Longhao ; Li, Xi

  • Author_Institution
    Dept. of CS, Univ. of Sci. & Technol. of China, Hefei, China
  • Volume
    2
  • fYear
    2010
  • fDate
    22-24 June 2010
  • Abstract
    In this paper, we study the interdependency between leakage energy and chip temperature on embedded systems. We present a DVFS approach targeted towards a task sequence aimed to minimize total energy dissipation. This approach determines an appropriate execution frequency based on the current temperature, thermal state, and task´s characteristics. Our method utilizes the Performance Monitor Unit (PMU) and on-chip temperature sensor to collect the statistics needed for frequency selection. We design an online algorithm to regulate frequency at each switch point. We have implemented the proposed technique in Linux 2.6.29.1 running on an Intel Pentium M750 platform. Our measurements show that we can achieve average 21.6% total energy savings.
  • Keywords
    embedded systems; frequency control; low-power electronics; power aware computing; system-on-chip; temperature sensors; DVFS; Intel Pentium M750 platform; Linux 2.6.29.1; chip temperature; current temperature; dynamic voltage frequency scaling; embedded system; energy dissipation; execution frequency; frequency regulation; frequency selection; leakage energy; on-chip temperature sensor; online algorithm; performance monitor unit; task sequence; temperature-aware energy minimization technique; thermal state; Algorithm design and analysis; Dynamic voltage scaling; Embedded system; Energy dissipation; Frequency; Monitoring; Phasor measurement units; Statistics; Switches; Temperature sensors; DVFS; Energy minimization; Task Sequence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Education Technology and Computer (ICETC), 2010 2nd International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-6367-1
  • Type

    conf

  • DOI
    10.1109/ICETC.2010.5529329
  • Filename
    5529329