DocumentCode
52518
Title
Forced-Air Cooling System Design Under Weight Constraint for High-Temperature SiC Converter
Author
Puqi Ning ; Fei Wang ; Ngo, Khai D. T.
Author_Institution
Beijing Eng. Lab. of Electr. Drive Syst. & Power Electron. Device Packaging Technol., Inst. of Electr. Eng., Beijing, China
Volume
29
Issue
4
fYear
2014
fDate
Apr-14
Firstpage
1998
Lastpage
2007
Abstract
An analytical model has been developed for predicting the forced-air cooling system performance, including a detailed optimization process to minimize the total weight. With a design example in a high-density high-temperature SiC converter, the presented design method was verified through numerical simulations and experiments.
Keywords
cooling; numerical analysis; optimisation; power convertors; silicon compounds; thermal management (packaging); wide band gap semiconductors; SiC; design method; forced-air cooling system design; forced-air cooling system performance; high-density high-temperature converter; high-temperature silicon carbide converter; numerical simulations; optimization process; weight constraint; Cooling; Ducts; Geometry; Heat transfer; Heating; Silicon carbide;
fLanguage
English
Journal_Title
Power Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0885-8993
Type
jour
DOI
10.1109/TPEL.2013.2271259
Filename
6565414
Link To Document