Title :
LTCC-Based Substrate Integrated Image Guide and Its Transition to Conductor-Backed Coplanar Waveguide
Author :
Yu Jian Cheng ; Xiao Yue Bao ; Yong Xin Guo
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
Abstract :
A substrate integrated image guide (SIIG) transmission line based on the low temperature co-fired ceramic (LTCC) technology is proposed in this letter. Compared with other existed SIIGs, this configuration is easier to design and offers better fabrication reliability. Then, a compact transition between a SIIG and a conductor-backed coplanar waveguide (CPW) is designed and fabricated. Within the frequency range of 56.5 ~ 67.5 GHz, the measured return loss is better than 10.8 dB while the maximal insertion loss is 3.4 dB including a back-to-back CPW-SIIG transition and a 30 mm length SIIG. Therefore, the measured insertion loss for such a transition from the CPW to the SIIG is evaluated to 0.748 dB at the center frequency of 62 GHz.
Keywords :
ceramic packaging; circuit reliability; coplanar transmission lines; coplanar waveguides; losses; network synthesis; submillimetre wave circuits; substrate integrated waveguides; waveguide transitions; CPW; LTCC technology; SIIG; conductor-backed coplanar waveguide; frequency 56.5 GHz to 67.5 GHz; loss 0.748 dB; loss 3.4 dB; low temperature cofired ceramic technology; maximal insertion loss measurement; reliability; return loss; size 30 mm; substrate integrated image guide transmis- sion line; Ceramics; Coplanar waveguides; Dielectrics; Loss measurement; Millimeter wave technology; Strips; Substrates; Coplanar waveguide (CPW); Substrate integrated image guide (SIIG); low temperature co-fired ceramic (LTCC);
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2013.2272608
