DocumentCode :
525871
Title :
The influence of the layout on the ESD performance of HV-LDMOS
Author :
Lee, Jian-Hsing ; Su, Hung-Der ; Chan, Chien-Ling ; Yang, D.H. ; Chen, Jone F. ; Wu, K.M.
Author_Institution :
Technol. Dev. Div., Richtek Technol. Corp., Chubei, Taiwan
fYear :
2010
fDate :
6-10 June 2010
Firstpage :
303
Lastpage :
306
Abstract :
The root causes of the high voltage (HV) LDMOS (Fig. 2) failed at the low voltage electrostatic-discharge (ESD) zap is found. One is caused by the bulk layout and one is caused by the intrinsic characteristic of the device. From the findings, a new structure is proposed to eliminate the root causes without sacrificing the IV characteristics and dimension of the device.
Keywords :
electrostatic discharge; low-power electronics; power MOSFET; ESD performance; ESD zap; HV-LDMOS; bulk layout; high voltage LDMOS; low voltage electrostatic-discharge; Cities and towns; DH-HEMTs; Electrostatic discharge; Implants; Microelectronics; Power semiconductor devices; Research and development; Stress; Testing; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2010 22nd International Symposium on
Conference_Location :
Hiroshima
ISSN :
1943-653X
Print_ISBN :
978-1-4244-7718-0
Electronic_ISBN :
1943-653X
Type :
conf
Filename :
5543900
Link To Document :
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