DocumentCode :
525916
Title :
A computationally efficient electro-thermal modelling technique for coupled Multi-Disciplinary Analysis of Multi-Chip Power Modules
Author :
Evans, P. ; Castellazzi, A. ; Carastro, F. ; Johnson, C.M.
Author_Institution :
Sch. of Electr. & Electron. Eng., Univ. of Nottingham, Nottingham, UK
fYear :
2010
fDate :
6-10 June 2010
Firstpage :
297
Lastpage :
300
Abstract :
Compact thermal impedance models allow fast, fully coupled electro-thermal simulation of multi-chip power modules. Usually, these models are generated through a time and labour intensive process of curve fitting to data points obtained experimentally or from finite-element simulations. This paper demonstrates a new, much faster, technique which mathematically derives such models and validates it against experimental measurements for an example multi-chip module. The ease of use and coupling capabilities of the models when used with an accurate device model is then demonstrated.
Keywords :
curve fitting; finite element analysis; multichip modules; power electronics; compact thermal impedance; coupled multi-disciplinary analysis; curve fitting; electro-thermal modelling; finite-element simulations; multi-chip power modules; Computational modeling; Coupled mode analysis; Multichip modules;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2010 22nd International Symposium on
Conference_Location :
Hiroshima
ISSN :
1943-653X
Print_ISBN :
978-1-4244-7718-0
Electronic_ISBN :
1943-653X
Type :
conf
Filename :
5544019
Link To Document :
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