Title :
Development of 6kV-class SiC-PiN diodes for high-voltage power inverter
Author :
Tanaka, Yasunori ; Ohashi, Hiromichi ; Sung, Kyungmin ; Wada, Keiji ; Kanai, Takeo ; Takao, Kazuto
Author_Institution :
Energy Semicond. Electron. Res. Lab., Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba, Japan
Abstract :
We succeeded to develop the SiC-PiN diodes with the breakdown voltage VBR of > 6 kV and active area of 16 mm2. On-voltages at 25°C were 3.38 V at forward current density JF of 100 A/cm2 and 3.68 V at JF of 200 A/cm2. A negative shift of on-voltage was observed at the elevated temperatures. On-voltages at 125°C are 3.19 V at JF of 100 A/cm2 and 3.48 V at JF of 200 A/cm2. The avalanche breakdown was observed at 7.0 kV. The reverse recovery charge of SiC-PiN diode module, two paralleled chips mounted on DBC substrate, was as low as 11 μC at 125°C, while that of Si-PiN diode module with same current rating was 83 μC at the same temperature. By using hybrid pair module with Si-IEGTs and SiC-PiN diodes, we demonstrated the operation of prototype 3-level inverter with 378 kVA. We successfully confirmed the fast switching operation with 2 kHz, which is four times higher than conventional converters. The developed technology greatly reduces the size and the space of a high-voltage, high-power inverter systems.
Keywords :
avalanche breakdown; invertors; p-i-n diodes; silicon compounds; wide band gap semiconductors; DBC substrate; Si-IEGT; SiC; apparent power 378 kVA; avalanche breakdown; breakdown voltage; class SiC-PiN diode module; converters; fast switching operation; forward current density; frequency 2 kHz; high-voltage high-power inverter systems; hybrid pair module; negative shift of on-voltage; paralleled chips; reverse recovery charge; temperature 125 degC; temperature 25 degC; voltage 3.38 V; voltage 3.68 V; voltage 6 kV; voltage 7 kV; Anodes; Inverters; Passivation; Semiconductor diodes; Silicon carbide; Space technology; Substrates; Switching converters; Switching frequency; Temperature;
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2010 22nd International Symposium on
Conference_Location :
Hiroshima
Print_ISBN :
978-1-4244-7718-0
Electronic_ISBN :
1943-653X