Title :
Notice of Retraction
Research on acquisition system for vertical vibration characteristics of CWR track based on LabVIEW
Author :
Liu Yan ; Luo Yanyun ; Wang Xianghao
Author_Institution :
Institue of Railway & Urban Railway Transit, Tongji Univ., Shanghai, China
Abstract :
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
This paper presents a dynamic model for analysing the vertical vibration response characteristics of continuous welded rail (CWR) track under longitudinal temperature stress, and reveals that the parameters in the model, such as the wear of the rail, rail types, the sleeper unsupported spacing, have great influences on the relationship between the track vertical vibration characteristics and the longitudinal temperature stress. The datas of analysis and in-field measurements are compared, whose results identified that it´s feasible to predict the temperature stress of a CWR track by testing it´s vertical vibration frequency. A frequency acquisition program based on the LabVIEW is presented at last.
Keywords :
rails; railway engineering; vibrations; virtual instrumentation; wear; LabVIEW; continuous welded rail track; dynamic model; frequency acquisition program; in-field measurement; longitudinal temperature stress; rail types; rail wear; sleeper unsupported spacing; track vertical vibration characteristics; vertical vibration response characteristics; Fasteners; Rails; Software; Vibrations; Welding; LabVIEW; continuous welded rail; longitudinal temperature stress; vertical vibration characteristics;
Conference_Titel :
Computer Science and Information Technology (ICCSIT), 2010 3rd IEEE International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-5537-9
DOI :
10.1109/ICCSIT.2010.5564635