Title :
Electrical packaging characteristics of a 25-Gbit/s low-cost coaxial laser module
Author :
Tseng, Pei-Hao ; Shih, Tien-Tsorng ; Chen, Hao-Wei ; Wu, Yaw-Dong ; Cheng, Wood-Hi
Author_Institution :
Dept. of Photonics, Nat. Sun Yat-sen Univ., Kaohsiung, Taiwan
Abstract :
An equivalent circuit model of a 25-Gbit/s coaxial laser module is built by extracting electrical characteristics of transistor outline (TO)-Can header, bonding wires, and load through ADS software. The frequency response and the eye diagram of the coaxial laser module are simulated under various source impedances.
Keywords :
electronics packaging; equivalent circuits; frequency response; semiconductor lasers; Can header; TO-Can header; bit rate 25 Gbit/s; bonding wires; coaxial laser module; electrical packaging; equivalent circuit model; eye diagram; frequency response; transistor outline; Bonding; Impedance; Integrated circuit modeling; Laser modes; Load modeling; Signal analysis;
Conference_Titel :
OptoElectronics and Communications Conference (OECC), 2010 15th
Conference_Location :
Sapporo
Print_ISBN :
978-1-4244-6785-3
