Title :
-Band Spatially Combined Power Amplifier Arrays in 45-nm CMOS SOI
Author :
Hanafi, Bassel ; Gurbuz, Ozan ; Dabag, Hayg ; Buckwalter, James F. ; Rebeiz, Gabriel ; Asbeck, Peter
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
Abstract :
This paper reports 45-GHz power amplifier (PA) arrays implemented in 45-nm CMOS silicon-on-insulator, coupled to antenna arrays to enable free-space power combining. A single CMOS chip (2.5 × 4.5 mm2) containing eight-unit PAs was developed and its output was fed to a 2 × 2 array of differentially fed patch antennas on a printed circuit board. This array provided an equivalent isotropic radiated power (EIRP) of 40 dBm at 45 GHz with 28 dBm of total RF power generated by the chip. A larger array, composed of four CMOS chips and feeding a 2 × 8 array of antennas, was shown to deliver an EIRP of 50 dBm at 45 GHz, while generating a total RF power of 33 dBm together with an antenna array gain of 17 dB. The dc power consumptions for the 2 × 2 and the 2 × 8 arrays were 4.9 and 18 W, respectively, with estimated peak power-added efficiencies of 13.5% and 10.7%.
Keywords :
CMOS analogue integrated circuits; MMIC power amplifiers; antenna feeds; elemental semiconductors; microstrip antenna arrays; power combiners; printed circuits; silicon; silicon-on-insulator; CMOS SOI; DC power consumption; EIRP; PA; Q-band spatially combined power amplifier array; Si; differentially fed patch antenna array; efficiency 10.7 percent; efficiency 13.5 percent; equivalent isotropic radiated power; free-space power combining; frequency 45 GHz; gain 17 dB; power 18 W; power 4.9 W; printed circuit board; silicon-on-insulator; size 45 nm; total RF power generation; Antenna arrays; CMOS integrated circuits; Field effect transistors; Gain; Logic gates; Radio frequency; Antenna array; millimeter wave; power amplifiers (PAs); spatial combining; stacked field-effect transistor (FET);
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2015.2424215