• DocumentCode
    530911
  • Title

    Compact front end modules for WLAN applications with integrated passive devices using selectively anodized aluminum substrate

  • Author

    Yu, Je-In ; Yook, Jong-Min ; Park, Jun-Chul ; Kim, Cheol-Ho ; Kwon, Young-Se

  • Author_Institution
    Dept. of Electr. Eng., KAIST, Daejeon, South Korea
  • fYear
    2010
  • fDate
    27-28 Sept. 2010
  • Firstpage
    329
  • Lastpage
    332
  • Abstract
    In This paper, two types of front end modules (FEM) for IEEE 802.11a/b/c WLAN with integrated passive devices (TPD) on selectively anodized aluminum substrate were proposed and fabricated. These FEMs are composed of 2.4GHz LNA, 2.4GHz PA, 5GHz PA, RF switch and IPDs such as low pass filter, diplexer, and balanced band pass filter. The IPDs designed and fabricated for WLAN frequency range had enough specification satisfying commercial passive device requirements. And 2.4GHz PA also designed to attain high output RF power, 27dBm, using GaAs pHEMT and R, L, C component on selectively anodized aluminum substrate. The IPDs and FEMs were fabricated using Wavnics, Inc´s Smart Al® foundry. The fully integrated FEMs had the sizes of 4.8mm × 3.8mm for single band FEM and 5.8 × 4.4mm for dual band FEM respectively.
  • Keywords
    III-V semiconductors; UHF power amplifiers; aluminium; band-pass filters; gallium arsenide; high electron mobility transistors; low noise amplifiers; low-pass filters; microwave power amplifiers; multiplexing equipment; substrates; telecommunication standards; wireless LAN; Al; GaAs; IEEE 802.11a/b/c; LNA; RF switch; UHF power amplifier; WLAN; Wavnics, Inc´s Smart Al foundry; balanced band pass filter; compact front end modules; diplexer; frequency 2.4 GHz; frequency 5 GHz; integrated passive devices; low pass filter; microwave power amplifier; pHEMT; selectively anodized aluminum substrate; Aluminum; Band pass filters; Finite element methods; Magnetic separation; Radio frequency; Substrates; Wireless LAN;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuits Conference (EuMIC), 2010 European
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-7231-4
  • Type

    conf

  • Filename
    5613687