DocumentCode
531317
Title
A temperature insensitive DC-contact RF-MEMS switch
Author
Gong, Songbin ; Reck, Theodore ; Barker, N. Scott
Author_Institution
Univ. of Virginia, Charlottesville, VA, USA
fYear
2010
fDate
28-30 Sept. 2010
Firstpage
1114
Lastpage
1117
Abstract
This article details an investigation on the temperature variation of cantilever-structured RF-MEMS switches. Temperature-induced out-of-plane deformation of the cantilever was observed in the measurement of cryogenic switches in this research. Three-dimensional multi-physics finite element analysis was performed to explain the deformation. Experimental results are also shown to verify the simulation results. A stress-relaxation geometry is proposed and fabricated for a temperature insensitive switch design. The measured temperature insensitive switch demonstrates an actuation voltage response to temperature of 11 mV/K over 220 K temperature range (300 to 77 K) and outstanding broadband RF performance with an insertion-loss less than 0.8 dB and isolation better than 24 dB up to 50 GHz.
Keywords
electrical contacts; geometry; microswitches; stress relaxation; cantilever-structured RF-MEMS switches; stress-relaxation geometry; temperature insensitive DC-contact; temperature-induced out-of-plane deformation; Cryogenic; DC-contact; MEMS; broadband; cantilever; low loss; series switch;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference (EuMC), 2010 European
Conference_Location
Paris
Print_ISBN
978-1-4244-7232-1
Type
conf
Filename
5616087
Link To Document