• DocumentCode
    531317
  • Title

    A temperature insensitive DC-contact RF-MEMS switch

  • Author

    Gong, Songbin ; Reck, Theodore ; Barker, N. Scott

  • Author_Institution
    Univ. of Virginia, Charlottesville, VA, USA
  • fYear
    2010
  • fDate
    28-30 Sept. 2010
  • Firstpage
    1114
  • Lastpage
    1117
  • Abstract
    This article details an investigation on the temperature variation of cantilever-structured RF-MEMS switches. Temperature-induced out-of-plane deformation of the cantilever was observed in the measurement of cryogenic switches in this research. Three-dimensional multi-physics finite element analysis was performed to explain the deformation. Experimental results are also shown to verify the simulation results. A stress-relaxation geometry is proposed and fabricated for a temperature insensitive switch design. The measured temperature insensitive switch demonstrates an actuation voltage response to temperature of 11 mV/K over 220 K temperature range (300 to 77 K) and outstanding broadband RF performance with an insertion-loss less than 0.8 dB and isolation better than 24 dB up to 50 GHz.
  • Keywords
    electrical contacts; geometry; microswitches; stress relaxation; cantilever-structured RF-MEMS switches; stress-relaxation geometry; temperature insensitive DC-contact; temperature-induced out-of-plane deformation; Cryogenic; DC-contact; MEMS; broadband; cantilever; low loss; series switch;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (EuMC), 2010 European
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-7232-1
  • Type

    conf

  • Filename
    5616087