• DocumentCode
    531415
  • Title

    MoL analysis of the mechanical behaviour of acoustic mirrors

  • Author

    Taghavi, Amirali ; Vietzorreck, Larissa

  • Author_Institution
    Lehrstuhl fur Hochfrequenztech., Tech. Univ. Munchen, München, Germany
  • fYear
    2010
  • fDate
    28-30 Sept. 2010
  • Firstpage
    1317
  • Lastpage
    1320
  • Abstract
    Bulk acoustic wave (BAW) resonators are widely used, as they possess superior features when used as filters. BAW devices are less lossy and capable of more power handling in comparison to their rivals like discrete and SAW filters. They comprise of one active, piezoelectric layer, which is mounted on an acoustic isolated platform, that could be either a floating thin membrane or an acoustic mirror. Later - acoustic mirror - is an interleave of low and high acoustic impedance layers each with the length of λ/4. In today competitive and tight market a thorough analysis of any MEMS device is mandatory before manufacturing to inhibit extra cost of primary engineering mistakes. In this paper we employ a numeric techniques called Method of Lines (MoL) to model the mechanical behavior of the layered acoustic mirror structure. As the MoL is very efficient in simulating the EM properties of a layered topology, with a combination of both approaches a BAW resonator can be fully described. In this paper only the mechanical part is treated, its benefits and problems are described.
  • Keywords
    acoustic resonators; bulk acoustic wave devices; method of lines; micromechanical devices; mirrors; surface acoustic wave filters; BAW devices; BAW resonators; EM property; MEMS device; MoL analysis; SAW filters; acoustic impedance layers; acoustic isolated platform; acoustic mirrors; bulk acoustic wave resonators; discrete filters; floating thin membrane; layered topology; mechanical behaviour; method of lines; numeric techniques; piezoelectric layer; primary engineering mistakes; thorough analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (EuMC), 2010 European
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-7232-1
  • Type

    conf

  • Filename
    5616244