LCP device housing enables selective thermal management for RF device packages

RJR Polymers have developed a number of novel bonding technologies that allow the use of Liquid Crystal Polymer (LCP) housings to be attached to plated metal substrates and other materials, providing a reliable, near hermetic bond. The use of LCP molded parts as the housing significantly reduces the cost of parts compared to Ceramic or metal composites. Additionally the LCP housings can be custom designed to suit a range of applications. This paper shows a comparison of the various options undertaken and reviews the needs for selecting the right match of CTE and thermal performance for a range of different semiconductors. This demonstrates how the process of assembly of such packages determines the performance match and there are some examples of typical RF device applications which can utilise these processes.