DocumentCode :
531627
Title :
An efficient envelope transient simulation of S-Parameters circuits in system simulator
Author :
Mehdi, H. ; Bennadji, A. ; Mons, S. ; Ngoya, E. ; Quere, R.
Author_Institution :
Univ. of Limoges, Limoges, France
fYear :
2010
fDate :
28-30 Sept. 2010
Firstpage :
1050
Lastpage :
1053
Abstract :
We present here a novel approach on behavioral modeling of passive RF blocks from frequency domain samples. This approach combines the vectorfitting (VF) algorithm, which is a powerful iterative method for estimating the poles and residues of a MIMO system, associated with the inverse Laplace transform in order to implement passive RF models in a time domain system simulation environment. For our application, the Scilab/Scicos tool is chosen since it allows the resolution of implicit equations, therefore, the implementation of bilateral behavioral models. The impulse responses Sij(t) are then evaluated form previous poles/residues identification process in order to compute the implicit relationship between I and V at each port of the block. This method has been validated in the case of simple circuit (load) and extended to the case of complex MIMO sub-systems such as a full power combiner of a power amplifier (PA). As a result, the envelope transient (TE) S-parameters evaluation of circuits is possible. Thence, the evaluation of complex PAs is submitted to an actual signal (which often includes linear sub-circuits derived from Momentum simulation).
Keywords :
Laplace transforms; MIMO communication; S-parameters; iterative methods; power amplifiers; power combiners; MIMO system; S-parameters circuit; Scicos tool; Scilab tool; bilateral behavioral model; envelope transient simulation; inverse Laplace transform; iterative method; passive RF block; power amplifier; power combiner; vector fitting algorithm; Behavioral modeling; MIMO systems; Scilab/Scicos; envelope Transient (TE); vector fitting (VF);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference (EuMC), 2010 European
Conference_Location :
Paris
Print_ISBN :
978-1-4244-7232-1
Type :
conf
Filename :
5616591
Link To Document :
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