DocumentCode :
53292
Title :
Quench Propagation in YBCO Pancake: Experimental and Computational Results
Author :
Lecrevisse, Thibault ; Chaud, X. ; Debray, Francois ; Devaux, Melanie ; Fazilleau, Ph ; Juster, F.P. ; Miyoshi, Yasuyuki ; Rey, Jean-Michel ; Tixador, P. ; Vincent, B.
Author_Institution :
CEA-DSM-IRFU-SACM, Gif-sur-Yvette, France
Volume :
23
Issue :
3
fYear :
2013
fDate :
Jun-13
Firstpage :
4601805
Lastpage :
4601805
Abstract :
High-temperature superconductors are promising materials for future applications such as high field magnets thanks to their ability to carry high current densities. Nevertheless, their protection still remains a key issue mainly due to the slow velocity of quench propagation. To understand the quench behavior of a YBCO coil, a simulation code has been developed using the CASTEM-CEA finite element software. Simulations can be performed considering constant current and magnetic field. Results of those simulations will be displayed and a way for improving the protection by adding a stabilizer will be discussed. Two well instrumented YBCO coils were fabricated in order to obtain experimental data on quench propagation in pancake configuration. Their design and some measurements are reported in this paper along with another experiment on a double pancake made by and tested at CNRS Grenoble. Finally, we compare the numerical and experimental results and discuss the accuracy of our simulations.
Keywords :
barium compounds; current density; finite element analysis; high-temperature superconductors; superconducting coils; yttrium compounds; CASTEM-CEA finite element software; YBCO; YBCO coil; YBCO pancake; current density; high held magnets; high-temperature superconductors; quench propagation; simulation code; Coils; Copper; Insulation; Stability analysis; Thermal stability; Yttrium barium copper oxide; HTS quench propagation; HTS quench simulation; High-temperature superconductors (HTS) protection optimization; YBCO coil;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2013.2246753
Filename :
6461069
Link To Document :
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