DocumentCode
53292
Title
Quench Propagation in YBCO Pancake: Experimental and Computational Results
Author
Lecrevisse, Thibault ; Chaud, X. ; Debray, Francois ; Devaux, Melanie ; Fazilleau, Ph ; Juster, F.P. ; Miyoshi, Yasuyuki ; Rey, Jean-Michel ; Tixador, P. ; Vincent, B.
Author_Institution
CEA-DSM-IRFU-SACM, Gif-sur-Yvette, France
Volume
23
Issue
3
fYear
2013
fDate
Jun-13
Firstpage
4601805
Lastpage
4601805
Abstract
High-temperature superconductors are promising materials for future applications such as high field magnets thanks to their ability to carry high current densities. Nevertheless, their protection still remains a key issue mainly due to the slow velocity of quench propagation. To understand the quench behavior of a YBCO coil, a simulation code has been developed using the CASTEM-CEA finite element software. Simulations can be performed considering constant current and magnetic field. Results of those simulations will be displayed and a way for improving the protection by adding a stabilizer will be discussed. Two well instrumented YBCO coils were fabricated in order to obtain experimental data on quench propagation in pancake configuration. Their design and some measurements are reported in this paper along with another experiment on a double pancake made by and tested at CNRS Grenoble. Finally, we compare the numerical and experimental results and discuss the accuracy of our simulations.
Keywords
barium compounds; current density; finite element analysis; high-temperature superconductors; superconducting coils; yttrium compounds; CASTEM-CEA finite element software; YBCO; YBCO coil; YBCO pancake; current density; high held magnets; high-temperature superconductors; quench propagation; simulation code; Coils; Copper; Insulation; Stability analysis; Thermal stability; Yttrium barium copper oxide; HTS quench propagation; HTS quench simulation; High-temperature superconductors (HTS) protection optimization; YBCO coil;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2013.2246753
Filename
6461069
Link To Document