DocumentCode
533234
Title
A new approach of preparing electromic circuit on textile utilizing electrothermal
Author
Ji, Qiaoling ; Chen, Yitao ; Chen, Qiusheng ; Ji, Xiaowei ; Qi, Weimin
Author_Institution
Sch. of Electr. & Eng., Wuhan Textile Univ., Wuhan, China
Volume
11
fYear
2010
fDate
22-24 Oct. 2010
Abstract
Electroless plating has many advantages such as relatively low cost, feasibility to be applied on non-metal substrates and operated at room temperature with relative simple equipment, and the uniform and thick deposited metal for flexible circuit making. But it is also limited by poor accuracy, low speed and low repeatability. A new approach is proposed in this paper aiming at enhancing the Laser Induced Electroless plating on the fabric utilizing the AC electrothermal technology. A parametric model is also established and the simulation is carried out. The results show that it is not only effective and feasible, but also capable of minimizing the pollution greatly, and thus of great convenience for future smart textile combining with flexible circuit.
Keywords
electroless deposition; fabrics; flexible electronics; intelligent materials; AC electrothermal technology; electromic circuit; electrothermal; fabric; flexible circuit; laser induced electroless plating; parametric model; smart textile; Electric fields; Electrodes; Equations; Fluids; Mathematical model; Substrates; Textiles; Laser Induced Electroless Plating (LIEP); electrothermal technology; flexible circuit; smart textile;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Application and System Modeling (ICCASM), 2010 International Conference on
Conference_Location
Taiyuan
Print_ISBN
978-1-4244-7235-2
Electronic_ISBN
978-1-4244-7237-6
Type
conf
DOI
10.1109/ICCASM.2010.5623222
Filename
5623222
Link To Document