DocumentCode :
533350
Title :
Effects of TVS integration on system level ESD robustness
Author :
Huang, Wei ; Dunnihoo, Jeffrey ; Pommerenke, David
Author_Institution :
Electromagn. Compatibility Lab., Missouri Univ. of Sci. & Technol. (MST), Rolla, MO, USA
fYear :
2010
fDate :
3-8 Oct. 2010
Firstpage :
1
Lastpage :
6
Abstract :
Higher integration of Transient Voltage Suppression (TVS) functionality into ASIC I/O cells implies lower system costs. But as the ESD pulse is directed deeper into the system, migrating the TVS clamping function from the periphery of the system to a central ASIC may actually reduce the system´s ESD robustness. ESD current reconstruction scanning can be used to trace the current path on a PCB, and possibly within an IC. The article compares the current spreading during and ESD for different ESD protection methods.
Keywords :
application specific integrated circuits; electrostatic discharge; printed circuits; transient analysis; ASIC I/O cells; ESD current reconstruction scanning; ESD protection methods; ESD pulse; IC; PCB; TVS clamping function; TVS integration effect; system costs; system level ESD robustness; transient voltage suppression functionality; Application specific integrated circuits; Clamps; Electromagnetic compatibility; Electrostatic discharge; Probes; Robustness; Universal Serial Bus;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd
Conference_Location :
Reno, NV
Print_ISBN :
978-1-58537-182-2
Electronic_ISBN :
978-1-58537-182-2
Type :
conf
Filename :
5623717
Link To Document :
بازگشت