DocumentCode
533355
Title
Correlation between system level and TLP tests applied to stand-alone ESD protections and commercial products
Author
Besse, Patrice ; Laine, Jean-Philippe ; Salles, Alain ; Baird, Mike
Author_Institution
Freescale Semicond., Toulouse, France
fYear
2010
fDate
3-8 Oct. 2010
Firstpage
1
Lastpage
6
Abstract
This paper studies the correlation between the robustness level measured after a high current Transmission Line Pulse (TLP) test and the ruggedness obtained after gun stress used for system level tests. A relation has been confirmed using stand-alone ESD structures and commercial products using different technologies. A linear trend can be extracted depending on the R, C module of the gun. Measurement results will be detailed and discussed.
Keywords
electrostatic discharge; testing; transmission lines; TLP tests; commercial products; gun stress; high current transmission line pulse test; stand-alone ESD protections; stand-alone ESD structures; system level test correlation; Correlation; Current measurement; Electrostatic discharge; Hidden Markov models; Robustness; Stress; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd
Conference_Location
Reno, NV
Print_ISBN
978-1-58537-182-2
Electronic_ISBN
978-1-58537-182-2
Type
conf
Filename
5623723
Link To Document