Title :
Correlation between system level and TLP tests applied to stand-alone ESD protections and commercial products
Author :
Besse, Patrice ; Laine, Jean-Philippe ; Salles, Alain ; Baird, Mike
Author_Institution :
Freescale Semicond., Toulouse, France
Abstract :
This paper studies the correlation between the robustness level measured after a high current Transmission Line Pulse (TLP) test and the ruggedness obtained after gun stress used for system level tests. A relation has been confirmed using stand-alone ESD structures and commercial products using different technologies. A linear trend can be extracted depending on the R, C module of the gun. Measurement results will be detailed and discussed.
Keywords :
electrostatic discharge; testing; transmission lines; TLP tests; commercial products; gun stress; high current transmission line pulse test; stand-alone ESD protections; stand-alone ESD structures; system level test correlation; Correlation; Current measurement; Electrostatic discharge; Hidden Markov models; Robustness; Stress; Transmission line measurements;
Conference_Titel :
Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd
Conference_Location :
Reno, NV
Print_ISBN :
978-1-58537-182-2
Electronic_ISBN :
978-1-58537-182-2
