SCCF — System to component level correlation factor

Author

Thijs, S. ; Scholz, M. ; Linten, D. ; Griffoni, A. ; Russ, C. ; Stadler, W. ; Lafonteese, D. ; Vashchenko, V. ; Sawada, M. ; Concannon, A. ; Hopper, P. ; Jansen, P. ; Groeseneken, G.

Author_Institution

Imec, Leuven, Belgium

fYear

2010

fDate

3-8 Oct. 2010

Firstpage

1

Lastpage

10

Abstract

As a first step towards correlation of system level ESD robustness based on component level ESD results, on-wafer Human Metal Model (HMM) measurements are compared with on-wafer HBM for a wide range of devices in various process technologies. A device level System to Component level Correlation Factor (SCCF) is defined and can range from 10 to 150% based upon physical failure mechanisms. Five main categories are defined independent of process technology.

Keywords

electrostatic discharge; failure analysis; integrated circuit reliability; SCCF; component level ESD; on-wafer HBM; on-wafer human metal model measurements; physical failure mechanisms; process technology; system level ESD robustness correlation; system to component level correlation factor; Correlation; Current measurement; Electrostatic discharge; Hidden Markov models; Robustness; Stress; Voltage measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd

Conference_Location

Reno, NV

Print_ISBN

978-1-58537-182-2

Electronic_ISBN

978-1-58537-182-2

Type

conf

Filename

5623724