DocumentCode :
533358
Title :
Pulsed gate dielectric breakdown in a 32 nm technology under different ESD stress configurations
Author :
Yang, Yang ; Gauthier, Robert ; Sarro, James Di ; Li, Junjun ; Mitra, Souvick ; Chatty, Kiran ; Mishra, Rahul ; Ioannou, Dimitris E.
Author_Institution :
Dept. of Electr. & Comput. Eng., George Mason Univ., Fairfax, VA, USA
fYear :
2010
fDate :
3-8 Oct. 2010
Firstpage :
1
Lastpage :
8
Abstract :
We report pulsed high-k gate dielectric breakdown in various configurations emulating ESD stress in real input/output circuits. The stress on the receiver is of greater concern than is stress on the driver due to different gate oxide areas under stress. Methods to improve pad voltage tolerance for gate oxide breakdown are proposed.
Keywords :
MOSFET; electric breakdown; electrostatic discharge; high-k dielectric thin films; ESD stress configurations; MOSFET gate oxide thickness; input-output circuits; pad voltage tolerance; pulsed high-k gate dielectric breakdown; receiver; size 32 nm; Clamps; Electrostatic discharge; Immune system; Logic gates; MOSFET circuits; Stress; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd
Conference_Location :
Reno, NV
Print_ISBN :
978-1-58537-182-2
Electronic_ISBN :
978-1-58537-182-2
Type :
conf
Filename :
5623726
Link To Document :
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