DocumentCode :
533361
Title :
Maximizing ESD design window by optimizing gate bias for cascoded drivers in 45nm and beyond SOI technologies
Author :
Mitra, Souvick ; Gauthier, Robert ; Chang, Shunhua ; Li, Junjun ; Halbach, Ralph ; Seguin, Chris
Author_Institution :
Semicond. R&D Center, IBM, Essex Junction, VT, USA
fYear :
2010
fDate :
3-8 Oct. 2010
Firstpage :
1
Lastpage :
6
Abstract :
In advanced SOI technologies, the bottom gate voltage plays an important role in achieving the maximum trigger voltage Vt1 of the cascoded drivers. A comparable MOSFET and BJT current handling is needed to ensure maximum Vt1. The minimum and maximum Vt1 window for cascoded driver is shown to range between a single FET Vt1 and twice single FET Vt1.
Keywords :
MOSFET; bipolar transistors; driver circuits; silicon-on-insulator; BJT current handling; ESD design window; MOSFET; SOI technology; bottom gate voltage; cascoded drivers; size 45 nm; trigger voltage; twice single FET; Driver circuits; Earth Observing System; Electrostatic discharge; FETs; Logic gates; MOSFET circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd
Conference_Location :
Reno, NV
Print_ISBN :
978-1-58537-182-2
Electronic_ISBN :
978-1-58537-182-2
Type :
conf
Filename :
5623730
Link To Document :
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